I am planning to develop High Speed PCBs (10 layer & 16 layer) with following specification Specification:
(1) NO.of Layers (including Top & Bottom) : 10 & 16
(2) Impedance in ohms : 40,50,34,100
Queries send to PCB Manufacture:
(1)Layer stack up details
(2)Trace Thickness in each layer to achieve the above Impedance
(3)Via size to be maintained in each layer to achieve the above Impedance
(4)Board Thickness to be maintained for the specification
(5)For Back Drilling - spec to be maintained in PCB design
But no manufacturer is share the above request, So if anyone has their own detail kindly share so that i can follow & complete the PCB design.
(1) NO.of Layers (including Top & Bottom) : 10 & 16
(2) Impedance in ohms : 40,50,34,100
Queries send to PCB Manufacture:
(1)Layer stack up details
(2)Trace Thickness in each layer to achieve the above Impedance
(3)Via size to be maintained in each layer to achieve the above Impedance
(4)Board Thickness to be maintained for the specification
(5)For Back Drilling - spec to be maintained in PCB design
But no manufacturer is share the above request, So if anyone has their own detail kindly share so that i can follow & complete the PCB design.
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