Hello everyone, recently I have been working on a 10 layer board that has 6 Signal and 4 Power Plane Layers. Signals in each Signal Layer should be 55 ohm controlled impedance. After placement and before routing I asked my PCB manufacturer to share the required 10 Layer 55 ohm controlled stack-up so that I route the Signal layers as per his specs. However, the manufacturer suggested to make a rough 55 ohm layer stack-up that would later be tweaked as per their own capabilities. I resorted to Altium 19 Impedance calculator and managed to build a 55 Ohm signal layer stack-up by changing values of FR-4 Thickness, Track width randomly just to meet 55 Ohm criteria.
Would anyone please guide me proper required steps to build a controlled impedance layer stack-up and all other considerations that I need to have in mind. Attached is my layer stack-up.
Would anyone please guide me proper required steps to build a controlled impedance layer stack-up and all other considerations that I need to have in mind. Attached is my layer stack-up.
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