I have a regulator that dissipates much heat and It need to have a heat sink pad in PCB. I have placed a pool of Ground vias in the Heat sink pad area. The board is 4 layer with top and bottom signal/Gnd layer and middle layer GND and PWR. I want the dissipated heat to get sink into either top Layer or bottom layer pad and avoid the internal GND and Power layers to get connected to these heat sink vias so that the internal layer can avoid the regulator heat.
Problem:
The ground vias from Top to bottom layer get connected to the internal GND layer. Is there any way to avoid the Internal GND layer?
I checked the Middle layer Thermal Relief of these Vias to No Connect but still they are connected to Internal GND Layer.
If there is any way to achieve this then someone please guide me.
Thanks.
Problem:
The ground vias from Top to bottom layer get connected to the internal GND layer. Is there any way to avoid the Internal GND layer?
I checked the Middle layer Thermal Relief of these Vias to No Connect but still they are connected to Internal GND Layer.
If there is any way to achieve this then someone please guide me.
Thanks.
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