Hello,
I am working on design of Read out board and need to mount a 'detector' (bare Si Chip ) that require wire bonding from die to board. For creating bonding pads, I got one document named"Wire bonding in Altium designer" (attached). As per this document i would need to enable the signal midlayer to create die pads and landing pads. But in PCB library i can only see the Top and bottom signal layer. No idea how to create it. Is there any other way to create the bond pads in altium?
Thanks
Preeti
I am working on design of Read out board and need to mount a 'detector' (bare Si Chip ) that require wire bonding from die to board. For creating bonding pads, I got one document named"Wire bonding in Altium designer" (attached). As per this document i would need to enable the signal midlayer to create die pads and landing pads. But in PCB library i can only see the Top and bottom signal layer. No idea how to create it. Is there any other way to create the bond pads in altium?
Thanks
Preeti
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