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Polygon Copper Pour

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  • Polygon Copper Pour

    In lesson 5, clip 50 'Improving GNDS, adding multiple VIAS'.

    Doesn't adding this much copper to the capacitor pads cause a potential problem during mounting and soldering? Doesn't this require a lot more heat to properly solder the cap?



  • #2
    I do not know that specific part on the lessons, but there are indeed cases were it can cause soder issues.. in my experience that mostly happens on through hole connectors with multiple large planes connected.. a good practice is to add thermal reliefs in such cases for specific componentgroups which you can govern by the rules within altium..

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    • #3
      Please, what course do you mean? I can't find that specific section.

      When SMT components are soldered, the whole PCB is heated up, so everything is hot (including planes) and it will solder ok. If you are soldering through hole pins, then, as Paul van Avesaath suggested, using thermal relief may be considered (especially for GND)

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