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  • copper pour clearance

    Hi can anyone help, I have just poured a PCB and appear to be getting a strange result, the pin which should be connected is with thermal reliefs, the other pins the copper is going right up to the pad, what is the setting that controls this please Click image for larger version

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  • #2
    Hello,
    With AD20, Altium has made this a lot easier.

    Select the pad that you want to change the connect style to thermal.
    From properties panel -> Scroll down to the Pad stack section and enable the "Thermal relief" as shown in the attached image.

    You can edit the thermal relief setting by clicking the setting buttons "..." to configure the connects.
    Attached Files

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    • #3
      Generally, polygon connect style is controlled by rules, but can be also controlled on pin or polygon level.In your case, maybe have a look also into rules:

      Click image for larger version

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