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Routing Vias

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  • Routing Vias


    I have a question about routing and vias placement. "For example, if you have a 6 layers PCB, a microvia from layer 1 to layer 2, a buriedvia from layer 2 to layer 5 and I would like to get to layer 3. Is it necessary the small connection between vias on layer 2 (through a small track) ? Or is it possible to place those two vias (micro and buried) one next to the other in a vertical position all way down. In other words, what I'm saying is, place the micro via and under this the buried via, I noticed Altium allows me to get to layer 3 without a connection (track) between vias"

    Sorry for the question I new in Altium. I hope you get me.
    Thank you in advance.

  • #2

    It's possible to stack via structures, but it's usually best to avoid doing this. The connection can be unreliable in rugged conditions.


    • #3
      You should not put a micro via on top of a buried via (stacked). Not only is it unreliable in rugged conditions and WhoKnewKnows mentions, it can already fail during assembly.


      • #4
        You can consider to use also a through hole via for that connection
        PS: I agree with WhoKnewKnows and qdrives