You could think about via in pad when doing low pitch BGA fan-out, but I'm talking about e.g. a mounting hole shown below: via in pad for low inductance coupling between top and bottom and also in order to provide mechanical strength. The via's are defined in the footprint.

The problems I experience are twofold: first of all, I need to set the via to pad clearance to 0 in order for this to pass when placed on a PCB. I don't want to do this but if I don't, this component causes DRC clearance errors.
The 2nd problem that I encounter are another DRC error: Net Antennae: Via (...) from Top Layer to Bottom Layer. I understand that this suggests top and bottom are not on the same net, but in fact they are, it's all ground. It's as if these via's are no correctly electrically coupled to the pad. In footprint definition, i could not find a way to specifie this either.
There must be a way to do this correctly, these kind of electrically connected mechanical pads are common practice IMHO.
Any suggestions welcomed.
Cheers, Marc
The problems I experience are twofold: first of all, I need to set the via to pad clearance to 0 in order for this to pass when placed on a PCB. I don't want to do this but if I don't, this component causes DRC clearance errors.
The 2nd problem that I encounter are another DRC error: Net Antennae: Via (...) from Top Layer to Bottom Layer. I understand that this suggests top and bottom are not on the same net, but in fact they are, it's all ground. It's as if these via's are no correctly electrically coupled to the pad. In footprint definition, i could not find a way to specifie this either.
There must be a way to do this correctly, these kind of electrically connected mechanical pads are common practice IMHO.
Any suggestions welcomed.
Cheers, Marc
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