Hi Guys,
I am dealing with wafer level chip scale package (WLCSP) devices, the pin pitch is very low 0.4mm and it needs uVIA and laser drilling, wondering do you have working experience with this sort of packages?
I am dealing with wafer level chip scale package (WLCSP) devices, the pin pitch is very low 0.4mm and it needs uVIA and laser drilling, wondering do you have working experience with this sort of packages?
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