Hi,
I'm using the Polygon Pour option to create a ground plane on the top layer, but I noticed that some pads are not being connected and after spending several hours on this I'm not able to find why.
Any idea what might be causing this and how to solve it?
I suspect some kind of clearance rule issue. I've configured a clearance of 0.6mm between copper-track and also copper and SMD pad. Because I need 0.6mm clearance for the transmission lines. Maybe there is a way to ignore this clearance for the IC pads.
I'll attach some pictures.
Thanks!


I'm using the Polygon Pour option to create a ground plane on the top layer, but I noticed that some pads are not being connected and after spending several hours on this I'm not able to find why.
Any idea what might be causing this and how to solve it?
I suspect some kind of clearance rule issue. I've configured a clearance of 0.6mm between copper-track and also copper and SMD pad. Because I need 0.6mm clearance for the transmission lines. Maybe there is a way to ignore this clearance for the IC pads.
I'll attach some pictures.
Thanks!
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