If I have a 6 layer board:
L1 ________________Mounting Pads/Low Freq. Signals
L2 ________________Ground
L3 ________________High Freq. Signals
L4 ________________High Freq. Signals
L5 ________________Power
L6 ________________Low Freq. Signals
Whats the best way to join components on the bottom layer to ground?
1. A via form L6 to L2? I micro-via wont go that deep in one go so it would require a load of multiple-via's for every pad.
2. A standard through via from L1 to L6? Takes up a lot of space on all layers
3. Something else?
L1 ________________Mounting Pads/Low Freq. Signals
L2 ________________Ground
L3 ________________High Freq. Signals
L4 ________________High Freq. Signals
L5 ________________Power
L6 ________________Low Freq. Signals
Whats the best way to join components on the bottom layer to ground?
1. A via form L6 to L2? I micro-via wont go that deep in one go so it would require a load of multiple-via's for every pad.
2. A standard through via from L1 to L6? Takes up a lot of space on all layers
3. Something else?
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