Hello,
Do someone have experiences with back drilled VIAs in Altium? I have defined it for high speed (12.5Gbps) lines. Everything looks good except one thing. When I was checking exported gerbers data I saw, that in layers where the VIA is back drilled, Altium added copper with the same diameter like is the back-drill diameter. Do someone know why?
Here is an example for some inner layer in which the VIA will be drilled. Maybe it is due to mechanical support during drilling? If not, does exist some option in Altium how to remove it?
Thank you for the answer.
Do someone have experiences with back drilled VIAs in Altium? I have defined it for high speed (12.5Gbps) lines. Everything looks good except one thing. When I was checking exported gerbers data I saw, that in layers where the VIA is back drilled, Altium added copper with the same diameter like is the back-drill diameter. Do someone know why?
Here is an example for some inner layer in which the VIA will be drilled. Maybe it is due to mechanical support during drilling? If not, does exist some option in Altium how to remove it?
Thank you for the answer.
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