Dear Sir,
I have developed an 8 layer PCB design for an FPGA device containing around 10000 tracks and 1000 vias. PCB manufacturer is encouraging me not to use blind, buried vias so to minimize cost and because this is not compatible with the standards and also rarely used. But it is rather difficult for me to avoid them because design is rather complex.
Therefore when I shall use blind buried vias? How I can avoid them ?
Can I use with Altium through hole PCBs with stubs thus avoiding buried, blind vias for high speed PCB design? Any other recommendation is appreciated.
Thanks.
Regards,
Clive
I have developed an 8 layer PCB design for an FPGA device containing around 10000 tracks and 1000 vias. PCB manufacturer is encouraging me not to use blind, buried vias so to minimize cost and because this is not compatible with the standards and also rarely used. But it is rather difficult for me to avoid them because design is rather complex.
Therefore when I shall use blind buried vias? How I can avoid them ?
Can I use with Altium through hole PCBs with stubs thus avoiding buried, blind vias for high speed PCB design? Any other recommendation is appreciated.
Thanks.
Regards,
Clive
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