Hi Guys,
In big multi-layer boards, there are situation that via is placed in space between cutout of planes, here is an example:

that via may cause some manufacturing issues, my PCB manufacturer complain and blame me for possible fault, as it happened once.
My question is, can we create some design rule to detect situation like this?
BR,
In big multi-layer boards, there are situation that via is placed in space between cutout of planes, here is an example:
that via may cause some manufacturing issues, my PCB manufacturer complain and blame me for possible fault, as it happened once.
My question is, can we create some design rule to detect situation like this?
BR,
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