Hello Guys,
I'm Designing my first 4 Layer PCB and had a issue with return current path of my USB lines on Bottom Layer.
my stack-up is like this:
TOP Signal
Prepreg---------0.1mm
GND
Core-------------1.265mm
Power
Pregreg---------0.1mm
BOT Signal
So I cut the Power Plane and draw a GND polygon under USB and other signals.
Is this a right thing to do or I better stitch power and GND with 100nf caps near every Via?
Thank you for your time.
I'm Designing my first 4 Layer PCB and had a issue with return current path of my USB lines on Bottom Layer.
my stack-up is like this:
TOP Signal
Prepreg---------0.1mm
GND
Core-------------1.265mm
Power
Pregreg---------0.1mm
BOT Signal
So I cut the Power Plane and draw a GND polygon under USB and other signals.
Is this a right thing to do or I better stitch power and GND with 100nf caps near every Via?
Thank you for your time.
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