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Hello there, I created a simple 2 layers expansion board to try an EDA tool. It is made to connect a development board's GPIOs to SMD push buttons, LEDs and a DIP Switch 4. The connection from the development board to the expansion board is made with a 2x10 header. The uC input GPIOs are to be pulled up and debounced internally so I simply connected these to GND for the push buttons and the DIP Switch.
I have a big ground plane on the top and bottom layers. I placed many more vias than necessary regularly on the whole ground plane, I am not sure if the regular vias on the outline are good (protection against EMI) or useless though considering both ground planes cover the entire signal layers. I initially thought about making a ground plane only on the right side of the board around the GND connections on the top layer, would that have been a good option ? I used wide 25mils traces because I could but I guess thinner traces more isolated from one another would have been better ? Would you have placed the traces differently ? Should I isolate them more from the ground plane ? The gerber viewer top and bot views are attached.
Looking forward to your feedback.
I have a big ground plane on the top and bottom layers. I placed many more vias than necessary regularly on the whole ground plane, I am not sure if the regular vias on the outline are good (protection against EMI) or useless though considering both ground planes cover the entire signal layers. I initially thought about making a ground plane only on the right side of the board around the GND connections on the top layer, would that have been a good option ? I used wide 25mils traces because I could but I guess thinner traces more isolated from one another would have been better ? Would you have placed the traces differently ? Should I isolate them more from the ground plane ? The gerber viewer top and bot views are attached.
Looking forward to your feedback.
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