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Layer stackup for IMX6ULL project

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  • Layer stackup for IMX6ULL project

    Hello everyone,

    Im planning a project and want to ask which Layerstack you would choose.
    Ive made a first working prototype with IMX6ULL SoM and 4 Layers.
    Next step would be to integrate the IMX with RAM, eMMC and PMIC.

    The PCB contains:
    - IMX6ULL
    - 512mb DDR3 RAM
    - 8GB eMMC
    - PMIC
    - 2x Ethernet 100Mbps
    - 2x USB2.0
    - RS485
    - RS232
    - CAN
    - 2.4GHz Zigbee/BT
    - 868MHz wireless M-Bus

    PCB is around 90x70mm.


    My idea would be a 8-Layer Stack

    - Signal
    - GND
    - Signal
    - Power
    - GND
    - Signal
    - GND
    - Signal

    Is one Power Layer enough?
    What do you think? It should pass EMC testing.
    Last edited by VanBudd; 06-21-2021, 05:21 AM.

  • #2
    For the processor board, you will need at least 2 Power planes. I think you can go with 10 Layers adding power planes.
    Have a look at the reference design board or EVAL board and see how they have managed the power plane.
    https://www.youtube.com/watch?v=6aX9lA3W00A&t=65s

    Comment


    • #3
      I agree with Lakshmi. I also see 1 power plane as a possible problem. I am not sure how the pinout of ULL is looks, but often there are crossing power planes under CPU and they only can be routed on two layers (at least).

      Comment


      • #4
        Originally posted by Lakshmi View Post
        For the processor board, you will need at least 2 Power planes. I think you can go with 10 Layers adding power planes.
        Have a look at the reference design board or EVAL board and see how they have managed the power plane.
        https://www.youtube.com/watch?v=6aX9lA3W00A&t=65s

        Thank you very much for your answer!

        If the distance between Layer 3 (Signal) to Layer 2 (GND) and Layer 6 (Signal) to Layer 7 (GND) is much smaller then the distance to Layer 4 and 5 can i go with Power on Layer 4 and 5?
        So the reference plane for the signallayers should be the outer GND Layers.

        - Signal
        - GND
        - Signal
        - Power
        - Power
        - Signal
        - GND
        - Signal

        Or should i go with Roberts 10-Layer stack with four Powerplanes?
        I have no HDMI, SD, PCIe etc. So i need only 5V, 3V3 and the processors power, which i think is VDD_DDR3, VDD_SOC and VDD_ARM (please correct me if im wrong).
        So do you think two Powerplanes will be enough ?

        Comment


        • #5
          Originally posted by robertferanec View Post
          I agree with Lakshmi. I also see 1 power plane as a possible problem. I am not sure how the pinout of ULL is looks, but often there are crossing power planes under CPU and they only can be routed on two layers (at least).
          Thank you very much for your answer!
          So i should go with your 10-Layer stack which you also use in OpenRex project?

          Comment


          • #6
            The evaluation board only have 4 Layers
            https://www.nxp.com/design/developme...X6ULL-EVK#t768

            T
            hats crazy! 😲

            Comment


            • #7
              The evaluation board only have 4 Layers
              - The module has 4 layers?

              PS: I normally do not use 8 layer stackup - exactly because I am not very happy how to order layers there. That is why we often use 10 layers instead.

              Comment


              • #8
                Originally posted by robertferanec View Post
                - The module has 4 layers?
                Yes, in the Design Files there is an allegro brd file of the SODIMM SoM with IMX6ULL where you can see the Layerstack.

                Comment


                • #9
                  Yes, in the Design Files there is an allegro brd file of the SODIMM SoM with IMX6ULL where you can see the Layerstack.
                  - then maybe the chip is designed for low layer count layout. Have a look how they did it.

                  Comment

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