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  • robertferanec
    replied
    I do not pour ground on signal layers as I am not convinced about effectivity of doing it and I think, in some cases it may cause problems. So I prefer to use solid GND plane. The gap I explained before is normally used between power planes or high current nets and other signals/planes.

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  • ican7
    replied
    Hi Robert, Thank you for your response. In terms of EMI, can you please elaborate why do we use the same value clearance for the ground pour through out the board ? Also how can I determine if the the value you have given is best for my application?

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  • robertferanec
    replied
    We normally use a gap 0.2mm - 0.5mm between polygon and other signals / polygons. Depends on how much space we have. We usually use one type of gap, preferably the bigger one (0.5mm). But I guess, other people may use it different way, you can use even a bigger gap.

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  • ican7
    started a topic Ground pour

    Ground pour

    I would like to use copper pour on top and bottom of the pcb and connect them to the ground net. I have low and high current tracks as well as differential pairs. Do I have to set different polygon clearance settings for each track thickness?
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