Thermal Pad/Vias

[JSCBLOG]

Hey, I'm using a chip (BQ24092DGQR) with a thermal pad underneath. How will I go about designing it? Do I just have a large area underneath it with just top paste layer, for creating the thermal pad? Also the datasheet mentions thermal vias...are they just normal vias in Altium? I put the datasheet below:

http://www.ti.com/lit/ds/symlink/bq24092.pdf

There's a video awhile back, is this related to my question?

https://www.youtube.com/watch?v=adyYnF1h4Sk

[Lakshmi]

Yes, You need to connect the Thermal pad to the VSS(GND)using via.
Yes Robert's video is related to that.
You can also have a look at the Evaluation board Layout (http://www.ti.com/product/BQ24092/toolssoftware) and also look at the 12. Layout section of the data sheet(Page No 28)
Thank you.

[robertferanec]

- I would follow footprint and paste recommendations from the datasheet you attached
- I am speaking about exposed pad and footprints in this video: https://www.youtube.com/watch?v=cMxXea16Hxc