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  • Thermal Pad/Vias

    Hey, I'm using a chip (BQ24092DGQR) with a thermal pad underneath. How will I go about designing it? Do I just have a large area underneath it with just top paste layer, for creating the thermal pad? Also the datasheet mentions thermal vias...are they just normal vias in Altium? I put the datasheet below:

    http://www.ti.com/lit/ds/symlink/bq24092.pdf

    There's a video awhile back, is this related to my question?

    https://www.youtube.com/watch?v=adyYnF1h4Sk
    Last edited by JSCBLOG; 01-17-2020, 02:58 AM.

  • #2
    Yes, You need to connect the Thermal pad to the VSS(GND)using via.
    Yes Robert's video is related to that.
    You can also have a look at the Evaluation board Layout (http://www.ti.com/product/BQ24092/toolssoftware) and also look at the 12. Layout section of the data sheet(Page No 28)
    Thank you.

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    • #3
      - I would follow footprint and paste recommendations from the datasheet you attached
      - I am speaking about exposed pad and footprints in this video: https://www.youtube.com/watch?v=cMxXea16Hxc

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