Hi Robert,
In Lesson 8 you showed a list of standard vendor PCB material thicknesses you should choose from if you are building your own stackup. You also presented a proposed stackup from a PCB vendor. I have the following questions:
1. The PCB vendor specified a number of materials for the stackup which are not on your list of standard materials (e.g. there is no 60um or 80um prepreg or 0.1mm core on the standard list). Why is the vendor not specifying "standard" materials?
2. Why are some of the "expected thicknesses" on the vendor stackup greater than the nominal material thickness and some are less? (e.g. the expected thickness of the 100um prepreg is 114.7um while the expected thickness of the 180um prepreg is 147.8um).
3. According to the vendor stackup, if you wanted a 72 ohm differential impedance on the outside layer, you would need a 0.145mm etch and a 0.120mm space between the pair. However, if you placed differential pairs with 0.1mm etch and 0.1mm spacing, as was the case with the VOIPAC processor module, you might have trouble making that change without collisions with other objects. Should you be getting this feedback from the vendor on the stackup before you start laying any tracks?
4. Why aren't there impedances shown for layers 6 and 7 in the vendor stackup table?
Thank you, Tom
In Lesson 8 you showed a list of standard vendor PCB material thicknesses you should choose from if you are building your own stackup. You also presented a proposed stackup from a PCB vendor. I have the following questions:
1. The PCB vendor specified a number of materials for the stackup which are not on your list of standard materials (e.g. there is no 60um or 80um prepreg or 0.1mm core on the standard list). Why is the vendor not specifying "standard" materials?
2. Why are some of the "expected thicknesses" on the vendor stackup greater than the nominal material thickness and some are less? (e.g. the expected thickness of the 100um prepreg is 114.7um while the expected thickness of the 180um prepreg is 147.8um).
3. According to the vendor stackup, if you wanted a 72 ohm differential impedance on the outside layer, you would need a 0.145mm etch and a 0.120mm space between the pair. However, if you placed differential pairs with 0.1mm etch and 0.1mm spacing, as was the case with the VOIPAC processor module, you might have trouble making that change without collisions with other objects. Should you be getting this feedback from the vendor on the stackup before you start laying any tracks?
4. Why aren't there impedances shown for layers 6 and 7 in the vendor stackup table?
Thank you, Tom
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