Hi Robert,
In performing the fanout of the BGA, I found that it was sometimes useful to move vias slightly to make room for the other vias or tracks. The fanout vias for a particular pad all are assigned the same net, so I am questioning just how close they can be to each other. Can you comment on the four cases I created below?
Cases #1 and #2 can be used for fanout of the BGA on L3; cases #3 and #4 could be used for fanout of the BGA on L10.
Case #1 is used in your original design of the module quite frequently and has a 0.154mm clearance between pads on L2, which is greater than 0.1mm, so no issue. Is case #2 an issue? In that case there is only a 0.013mm gap between the pads. This is not a problem electrically, as they are both assigned the same net, but would the PWB manufacturer have a problem with that?
In case #3, the gap between pads on L3 is only 0.04mm (which is considerably less than 0.1mm). You used this configuration quite often in your design, so I assume it must not be an issue. How about case #4? In that case the pads on L3 are actually overlapping. Is this considered a "stacked via" and should be avoided?
Thanks!

In performing the fanout of the BGA, I found that it was sometimes useful to move vias slightly to make room for the other vias or tracks. The fanout vias for a particular pad all are assigned the same net, so I am questioning just how close they can be to each other. Can you comment on the four cases I created below?
Cases #1 and #2 can be used for fanout of the BGA on L3; cases #3 and #4 could be used for fanout of the BGA on L10.
Case #1 is used in your original design of the module quite frequently and has a 0.154mm clearance between pads on L2, which is greater than 0.1mm, so no issue. Is case #2 an issue? In that case there is only a 0.013mm gap between the pads. This is not a problem electrically, as they are both assigned the same net, but would the PWB manufacturer have a problem with that?
In case #3, the gap between pads on L3 is only 0.04mm (which is considerably less than 0.1mm). You used this configuration quite often in your design, so I assume it must not be an issue. How about case #4? In that case the pads on L3 are actually overlapping. Is this considered a "stacked via" and should be avoided?
Thanks!
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