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If you know answers on any questions on this forum, please feel free to answer them. (PS: I try to answer at least once a week or when possible, - Robert)
Many designs today include three different value decoupling capacitors, or when using just one capacitor, a small value like 0.1 uF. These recommendations are based on 50-year-old assumptions that do not apply today. It is time to reconsider these out of date, legacy design guidelines.
As mnpebm said, there is no simple answer. It really depends on design e.g. there may be difference if you have two memory chips (one on top, one on bottom on top of each other) vs only one chip etc. But, if you are not sure, 1 cap per pin is fine (I would do the same).
Hello,
Power Distribution Network(PDN) Design is a area of PCB design which deals with this question in detail.
Primarily the decoupling capacitors are selected based on the allowable ripple content for a particular IC like DDR3/4/5 Ram modules etc..
This also depends on Power plane inductance which in turn is a function of Layer stackup.
Placement of decoupling caps is also very important for these high speeds since a couple of nH could hamper the operation.
Reference design is good place to start and important thing to keep in mind is the layer stack of the reference design.
if you are using the decoupling caps same as in the reference design ensure that layer stack also is also similar to it.
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