How many signal and power/gnd layers do you have? Where exactly data / add / cmd / clk signals are placed on the CPU?
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DDR2 Placement and Routing
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[email protected] please, I try to help, but I do not review designs. Thank you very much for understanding.
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Hi Robert,
I am using following 8 layer stackup, in this my doubt is i am using only one GND can you check is this ok r not,
Layer Number Layer Name Material Type 1 Top Dielectric Conductive 2 GND Dielectric Conductive 3 Inner 1 Dielectric Conductive 4 Inner2 Dielectric Conductive 5 PWR1 Dielectric Conductive 6 Inner 4 Dielectric Conductive 7 PWR2 Dielectric Conductive 8 Bottom Dielectric Conductive
Regards,
Venkatesh N
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Hi [email protected] it really depends on your circuit and design. You will need to be aware of your DDR2 track routing, reference planes, possible crosstalk between L3/L4 and currents flowing through the GND plane.
I normally don't use 8 layer PCB, because I always prefer to have at least one solid neighbour GND plane per high speed signal layer.
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Thanks Robert for your kind suggestion,
now i have changed the above stackup as per below, kindly check is this ok.
Layer Number Layer Name Material Type 1 Top Dielectric Conductive 2 GND1 Dielectric Conductive 3 Inner 1(DDR Signals) Dielectric Conductive 4 Inner2(DDR Signals) Dielectric Conductive 5 PWR Dielectric Conductive 6 Inner 3(DDR Signals) Dielectric Conductive 7 GND2 Dielectric Conductive 8 Bottom(DDR Signals) Dielectric Conductive
Regards,
Venkatesh N
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[email protected] I am not really sure what would you like to hearI can not say if its good or bad - if I was doing it, I would use 10 layer stackup
... for example, from my experience one PWR plane is not enough.
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