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DDR2 Placement and Routing

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  • #16
    How many signal and power/gnd layers do you have? Where exactly data / add / cmd / clk signals are placed on the CPU?

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    • #17
      Thank you very much Robert for your great time and kind support,
      OK i will do length matching as per the byte group method and i will send you the final PCB file for your kind review and feedback.



      Regards,
      Venkatesh N

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      • #18
        [email protected] please, I try to help, but I do not review designs. Thank you very much for understanding.

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        • #19
          Maybe we would try to do it this way - see the attached picture. However, I am not saying that this is the way you should do it nor that it is the best way to do it. It is just an initial idea.

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          • #20
            Hi Robert,
            I am using following 8 layer stackup, in this my doubt is i am using only one GND can you check is this ok r not,
            Layer Number Layer Name Material Type
            1 Top Dielectric
            Conductive
            2 GND Dielectric
            Conductive
            3 Inner 1 Dielectric
            Conductive
            4 Inner2 Dielectric
            Conductive
            5 PWR1 Dielectric
            Conductive
            6 Inner 4 Dielectric
            Conductive
            7 PWR2 Dielectric
            Conductive
            8 Bottom Dielectric
            Conductive

            Regards,
            Venkatesh N

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            • #21
              Hi [email protected] it really depends on your circuit and design. You will need to be aware of your DDR2 track routing, reference planes, possible crosstalk between L3/L4 and currents flowing through the GND plane.

              I normally don't use 8 layer PCB, because I always prefer to have at least one solid neighbour GND plane per high speed signal layer.

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              • #22
                Thanks Robert for your kind suggestion,
                now i have changed the above stackup as per below, kindly check is this ok.
                Layer Number Layer Name Material Type
                1 Top Dielectric
                Conductive
                2 GND1 Dielectric
                Conductive
                3 Inner 1(DDR Signals) Dielectric
                Conductive
                4 Inner2(DDR Signals) Dielectric
                Conductive
                5 PWR Dielectric
                Conductive
                6 Inner 3(DDR Signals) Dielectric
                Conductive
                7 GND2 Dielectric
                Conductive
                8 Bottom(DDR Signals) Dielectric
                Conductive

                Regards,
                Venkatesh N

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                • #23
                  [email protected] I am not really sure what would you like to hear I can not say if its good or bad - if I was doing it, I would use 10 layer stackup ... for example, from my experience one PWR plane is not enough.

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