Hello Everybody!
I have some questions about PCB layers and the Stackup:
1- I don't understand the differences between dielectric PREPEG layer and dielectric CORE layer.
I'm not sure, but i think this:
PREPEG: it's a dielectric layer in case the microstrip
CORE: It's a dielectric layer in case of the embedded microstrip and stripline
It's that correct??
2- I don't understand the difference in use between "embedded microstrip" and "stripline", both are in the dielectric but i would like when to use one or the other.
Thank you for the help.
Have a good day!
I have some questions about PCB layers and the Stackup:
1- I don't understand the differences between dielectric PREPEG layer and dielectric CORE layer.
I'm not sure, but i think this:
PREPEG: it's a dielectric layer in case the microstrip
CORE: It's a dielectric layer in case of the embedded microstrip and stripline
It's that correct??
2- I don't understand the difference in use between "embedded microstrip" and "stripline", both are in the dielectric but i would like when to use one or the other.
Thank you for the help.
Have a good day!

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