Hi
For 12 layers PCB I have seen below stackup in different places and also at this fedevel link( https://www.fedevel.com/welldoneblog...clearance-via/ ):
If I am going to use above stackup, should I follow a specific point in design (e.g. trace routing way on adjacent signal layers or prepreg or core thickness in stackup or ...)?
and at the end is there any priority for IMX6 stackup over above stackup?
Thanks.
For 12 layers PCB I have seen below stackup in different places and also at this fedevel link( https://www.fedevel.com/welldoneblog...clearance-via/ ):
- 12 Layers
- L1 – Signal
- L2 – GND
- L3 – Signal
- L4 – Signal
- L5 – GND
- L6 – Powers
- L7 – Powers
- L8 – GND
- L9 – Signal
- L10 – Signal
- L11 – GND
- L12 – Signal
If I am going to use above stackup, should I follow a specific point in design (e.g. trace routing way on adjacent signal layers or prepreg or core thickness in stackup or ...)?
and at the end is there any priority for IMX6 stackup over above stackup?
Thanks.
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