What have you found to be the minimum component clearance for reliable high density designs? Right now I've managed to get boards made with 0.005" spacing. For example the distance between two 0201 capacitors is 5 mil apart. I've also been making them with 0.01" spacing from the edge of the board and it seems to be ok with the manufacturer. What has been your experience with component clearances and clearance from board edge?
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Thanks mairomaster !! I should have checked the IPC specs. In your experience, have you used 8mil or went with something higher?
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Originally posted by mairomaster View PostAnything below 8mil (0.2 mm) even for the small 0201 components is being too close in my opinion. IPC agrees with that as well.
i find it kind of funny becauase if you have a 4mil clearance between traces. why do you need a 8 mil clearance to the components.. I can undestand why the IPC says it should be bigger.. but for manufacturing it would not be any different..
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i find it kind of funny becauase if you have a 4mil clearance between traces. why do you need a 8 mil clearance to the components..
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Originally posted by dlo View PostThanks mairomaster !! I should have checked the IPC specs. In your experience, have you used 8mil or went with something higher?
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